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Home > Services  > Assembly/implementation
  • Discrete
  • Wafer inspection
  • IC/LSI
  • Optical technology
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  • Discrete


Solution business of TOYO ELECTRONICS Co.,LTD

With our precision technologies for setting semiconductor and communications modules cultivated over our long track record in this field, we support your various demands for production processes at low prices and with short delivery periods.

    ・Device setting
    ・Surface mounting

Major production equipment list

Production equipment Analyzer
Wire bonders (Au, Al)
Dispenser robots
Solder paste printers
Baking furnaces
Reflow devices
X-ray inspection devices
PCB router cutting machines
Bonding testers
Compression/tensile testing devices
Helium leak-testing devices
Bubble leak-testing devices
Thermal shock testing devices
High-temperature and high-humidity
pressure-testing devices

We provide a wide variety of service in collaboration with semiconductor affiliate companies at Kofu area.