• Home
  • Company profile
  • Services
  • Business establishment
  • Employment information
  • Contact
Services
Home > Services > IC / LSI: final test
  • Discrete
  • Wafer inspection
  • IC/LSI
  • Optical technology
  • System development
  • Final test
  • Assembly
  • List of equipment at Niigata factory

Final test

Semiconductor department
Characteristics of final test

The electric characteristic test (final test) of completed (PKG) LSI product is carried out. Small lot production of many products are flexibly supported and the high reliability is provided to customers at low cost.

Moreover, external appearance inspection, solder ball inspection, taping, and other inspections are carried out with the final test.

<Example of introduction>

  • Electric characteristic test
    (Example of models: BGA, QFP, SOP)
  • External appearance inspection / solder ball inspection
  • Burn-in
  • Baking
  • Tray / reel taping
    (Example of model: BGA)

For the list of equipment, refer to here

Equipment environment at factory

Floor area 1,270m2
(can be used as a clean room)
Air conditioning management Temperature: 24±4°C
Humidity: 50±5%RH
Electrostatic discharge (ESD) management Ionizer is installed, wrist strap is attached
Conductive floor material is used
Antistatic working cloth and shoes are worn