We propose semiconductor testing with one-stop service as outsource flow images. In addition, we can handle a wide variety of services including the following partial services.

・Support with outside partners from back grind, dicing, assembly, taping, to shipping
・Support outsourcing of test system
・Partial request for wafer test, final test, ink mark, UV irradiation, retention bake, etc.
・Able to support even just one wafer or one IC package.
・Able to carry any shape of wafers.
・Our engineers can handle everything from test program creation, probe card design / prototyping based on the test specifications from the customer, debugging, and mass production.

Please feel free to contact us as we will assist you your second test process.

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